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ISL21080
Absolute Maximum Ratings
Max Voltage
V IN to GND . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.5V
V IN to GND (ISL21080-41 and 50 only) . . . -0.5V to +10V
V OUT to GND (10s) . . . . . . . . . . . . . . -0.5V to VOUT +1V
V OUT to GND (10s)
ISL21080-41 and 50 only . . . . . . . . . . -0.5V to +5.1V
ESD Ratings
Human Body Model (Tested to JESD22-A114) . . . . . . . 5kV
Machine Model (Tested to JESD22-A115) . . . . . . . . . 500V
Charged Device Model (Tested to JESD22-C101) . . . . . 2kV
Latch Up (Tested per JESD-78B; Class 2, Level A) . . . 100mA
Thermal Information
Thermal Resistance (Typical, Notes 5, 6) θ JA (°C/W) θ JC (°C/W)
3 Lead SOT-23 . . . . . . . . . . . . . . . 275 110
Maximum Junction Temperature . . . . . . . . . . . . . . . +107°C
Continuous Power Dissipation (T A = +85°C). . . . . . . . 99mW
Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile (Note 7) . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature. . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
Environmental Operating Conditions
X-Ray Exposure (Note 4). . . . . . . . . . . . . . . . . . . .10mRem
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. Measured with no filtering, distance of 10” from source, intensity set to 55kV and 70mA current, 30s duration. Other exposure
levels should be analyzed for Output Voltage drift effects. See “Applications Information” on page 14.
5. θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
6. For θ JC , the “case temp” location is taken at the package top center.
7. Post-reflow drift for the ISL21080 devices will range from 100μV to 1.0mV based on experimental results with devices on FR4
double sided boards. The design engineer must take this into account when considering the reference voltage after assembly.
8. Post-assembly x-ray inspection may also lead to permanent changes in device output voltage and should be minimized or
avoided. Initial accuracy can change 10mV or more under extreme radiation. Most inspection equipment will not affect the
FGA reference voltage, but if x-ray inspection is required, it is advisable to monitor the reference output voltage to verify
excessive shift has not occurred.
Electrical Specifications
(ISL21080-09, V OUT = 0.9V) V IN = 3.0V, T A = -40°C to +85°C, I OUT = 0, unless otherwise
specified. Boldface limits apply over the operating temperature range, -40°C to
+85°C.
MIN
MAX
PARAMETER
DESCRIPTION
CONDITIONS
(Note 12)
TYP
(Note 12)
UNIT
V OUT
Output Voltage
0.9
V
V OA
TC V OUT
V IN
I IN
V OUT Accuracy @ T A = +25°C (Notes 7, 8)
Output Voltage Temperature Coefficient
(Note 9)
Input Voltage Range
Supply Current
-0.7
2.0
0.35
+0.7
50
5.5
1.5
%
ppm/°C
V
μA
Δ V OUT / Δ V IN
Δ V OUT / Δ I OUT
I SC
t R
e N
V N
Δ V OUT / Δ T A
Δ V OUT / Δ t
Line Regulation
Load Regulation
Short Circuit Current
Turn-on Settling Time
Ripple Rejection
Output Voltage Noise
Broadband Voltage Noise
Noise Density
Thermal Hysteresis (Note 10)
Long Term Stability (Note 11)
2V < V IN < 5.5V
Sourcing: 0mA ≤ I OUT ≤ 10mA
Sinking: -10mA ≤ I OUT ≤ 0mA
T A = +25°C, V OUT tied to GND
V OUT = ±0.1% with no load
f = 120Hz
0.1Hz ≤ f ≤ 10Hz
10Hz ≤ f ≤ 1kHz
f = 1kHz
Δ T A = +125°C
T A = +25°C
30
6
23
30
1
-40
40
10
1.1
100
60
350
100
350
μV/V
μV/mA
μV/mA
mA
ms
dB
μV P-P
μV RMS
μV/ √ Hz
ppm
ppm
3
FN6934.4
May 25, 2010
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